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| Advance Product Datasheet April 6, 2006 10.7Gb/s Linear Optical Modulator Driver OC-192 Metro and Long Haul Applications Surface Mount Package TGA4819-SL Key Features and Performance * * * * * Up to 10 VPP Linear Output Voltage 20 dB Gain Internal DC Blocks Single-ended Input / Output Small Form Factor - 11.4 x 8.9 x 2 mm - 0.450 x 0.350 x 0.080 inches Primary Applications Description The TriQuint TGA4819-SL is part of a series of optical driver amplifiers suitable for a variety of driver applications. The TGA4819-SL is a medium power wideband AGC amplifier that typically provides 20dB small signal gain with 20dB AGC range. The TGA4819-SL is an excellent choice for applications requiring high drive combined with high linearity. The TGA4819-SL has demonstrated capability to deliver 10Vpp while maintaining output harmonic levels near -30dBc for a 2GHz fundamental. The TGA4819-SL requires a low frequency choke and control circuitry. * Mach-Zehnder Linear Modulator Driver for Metro and Long Haul Preliminary Measured Performance Bias Conditions: VD = 8V, VCTRL = +1V, ID = 310mA PRBS 231-1; 10.7Gbps; Vin = 1Vpp; CPC = 50% Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 1 Advance Product Datasheet April 6, 2006 TGA4819-SL TABLE I MAXIMUM RATINGS Symbol VD VG VCTRL ID | IG | PIN VIN PD TCH TM TSTG 1/ 2/ 3/ 4/ Drain Voltage Gate Voltage Range Control Voltage Range Drain Supply Current (Quiescent) Gate Supply Current Input Continuous Wave Power 10.7Gb/s PRBS Input Voltage Power Dissipation Operating Channel Temperature Mounting Temperature (10 Seconds) Storage Temperature Parameter Value 9V -3V to 0V -3V to VD/2 400 mA 5 mA 23 dBm 4 VPP 3.1 W 150 C 230 C -65 to 150 C 0 0 0 Notes 1/ 2/ 1/ 1/ 1/ 2/ 1/ 1/ 2/ 1/ 2/ 1/ 2/ 3/ 4/ These ratings represent the maximum operable values for this device Combinations of supply voltage, supply current, input power, and output power shall not exceed PD at a package base temperature of 70C When operated at this bias condition with a baseplate temperature of 70C, the MTTF is reduced to 1.0E+6 hours Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TABLE II THERMAL INFORMATION Parameter RJC Thermal Resistance (Channel to Backside of Package) Test Conditions VD = 8V ID = 350mA PDISS = 2.8W TBASE = 70C TCH (C) 142.8 RJC (C/W) 25.7 MTTF (hrs) 1.9E6 Note: Thermal transfer is conducted through the bottom of the TGA4819-SL package into the motherboard. The motherboard must be designed to assure adequate thermal transfer to the base plate. TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 2 Advance Product Datasheet April 6, 2006 TGA4819-SL TABLE III RF CHARACTERIZATION TABLE (TA = 25C, Nominal) (VD = 8V, VCTRL = +1V, ID = 310mA 5% , VG -0.3V) Parameter Test Conditions Typ Units Notes Small Signal Bandwidth 100 MHz - 4 GHz 6 GHz 10 GHz 14 GHz 100 MHz - 14 GHz 8 20 19 17 12 15 GHz Small Signal Gain dB 1/ 2/ Input Return Loss dB 1/ 2/ Output Return Loss 100 MHz - 14 GHz 13 dB 1/ 2/ Small Signal AGC Range Midband 20 dB Output Power @ P1dB 2 GHz 25.5 dBm 3/ Note: Table III Lists the RF Characteristics of typical devices as determined by fixtured measurements. 1/ 2/ 3/ Verified at package level RF test Package RF Test Bias: VD = 8V, VCTRL = +1V, adjust VG to achieve ID=310 mA Verified at die level on-wafer probe TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 3 Advance Product Datasheet April 6, 2006 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0 2 VD = 8V; VCTRL = +1V; ID = 310mA; VG -0.3V Measured Performance TGA4819-SL Gain (dB) 4 6 8 10 12 14 16 18 20 Frequency (GHz) 0 -5 S11 S22 Return Loss (dB) -10 -15 -20 -25 -30 0 2 4 6 8 10 12 14 16 18 20 Frequency (GHz) TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 4 Advance Product Datasheet April 6, 2006 TGA4819-SL VD = 8V; VCTRL = +1V; ID = 310mA; VG -0.3V Measured Performance 12 11 10 9 Vout (Vpp) 8 7 6 5 4 3 2 1 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Vin (Vpp) TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 5 Advance Product Datasheet April 6, 2006 VD = 8V; VCTRL = +1V; ID = 310mA; VG -0.3V PRBS 231-1; 10.7Gbps; CPC = 50% Measured Performance TGA4819-SL Vin = 500mVPP Vin = 1VPP Includes 8GHz Bessel Filter Input Signal Vin = 1VPP TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 6 Advance Product Datasheet April 6, 2006 TGA4819-SL Application Circuit VD C4 L1 R1 VCTRL L2 R2 C2 C3 VCTRL VD_BYP VD RF IN TGA4819 VG RF OUT C1 VG Note: 1. C1 extends low frequency performance to 30 KHz. For applications requiring low frequency performance to only 100 KHz, C1 may be omitted 2. C2 is a power supply decoupling capacitor and may be omitted when driven directly with an op-amp. TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 7 Advance Product Datasheet April 6, 2006 TGA4819-SL Application Circuit (Continued) Recommended Components: DESIGNATOR C1, C3 C2 C4 L1 L2 R1, R2 DESCRIPTION 10uF Capacitor MLC Ceramic 0.01 uFCapacitor MLC Ceramic 10 uF Capacitor Tantalum 220 uH Inductor 330 nH Inductor 274 Resistor MANUFACTURER AVX AVX AVX Belfuse Panasonic Coilcraft Panasonic PART NUMBER 0802YC106KAT 0603YC103KAT TAJA106K016R S581-4000-14 ELJ-FAR33MF2 0603LS-331XJB ERJ-2RKF2740X TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 8 Advance Product Datasheet April 6, 2006 TGA4819-SL Laboratory - Bias ON/OFF Procedure Vd=8V, CPC=50% Bias ON 1. Disable the output of the PPG 2. Set VD = 0V, VCTRL = 0V & VG = 0V 3. Set VG = -1.5V 4. Increase VD to 8V observing Id - Assure ID = 0mA 5. Set VCTRL = +1V - ID should still be 0mA 6. Make VG more positive until ID = 310mA. VG will be approximately -0.3V. 7. Enable the output of the PPG. Bias OFF 1. Disable the output of the PPG 2. Set VCTRL = 0V 3. Set VD = 0V 4. Set VG = 0V 8. Output Swing Adjust: Adjust VCTRL slightly positive to increase output swing or adjust VCTRL slightly negative to decrease the output swing. 9. Crossover Adjust: Adjust VG slightly positive to push the crossover down or adjust VG slightly negative to push the crossover up. TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 9 Advance Product Datasheet April 6, 2006 TGA4819-SL Mechanical Drawing .207 .407 15 16 17 19 .350 .326 10 11 12 13 14 .175 9 18 .438 Orientation Mark .024 .000 8 7 6 5 4 3 2 1 .000 .013 .412 .206 .235 .047 .087 .127 .167 .327 .367 .450 0.018" 0.018" 0.018" 0.018" 0.018" 0.018" 0.018" 0.020" 0.334" Bond Bond Bond Bond Bond Bond Bond Bond Bond Bond Pad Pad Pad Pad Pad Pad Pad Pad Pad Pad #1 #2 #3 #4 #5 #6 #7 #8 #9 #10 N/C N/C N/C N/C N/C VG N/C N/C RF Out N/C 0.025" 0.018" 0.018" 0.018" 0.018" 0.018" 0.018" 0.018" 0.020" 0.018" x x x x x x x x x x 0.041" 0.041" 0.041" 0.041" 0.041" 0.041" 0.041" 0.041" 0.018" 0.041" Bond Bond Bond Bond Bond Bond Bond Bond Bond Pad Pad Pad Pad Pad Pad Pad Pad Pad #11 #12 #13 #14 #15 #16 #17 #18 #19 N/C VD N/C N/C N/C VD_BYP VCTRL RF In GND x x x x x x x x x 0.041" 0.041" 0.041" 0.041" 0.041" 0.041" 0.041" 0.018" 0.187" NOTES: 1. Maximize number of vias on attachment area of PCB for Bond Pad #19. This is required electrical and thermal conduction 2. Pad sizes for RF input and output (#18, #9) are shown for soldermask opening. Solder should not be applied outside of this area. Dimensions: Inches Tolerances: Length & Width: 0.003" Height: 0.006" Adjacent Pad to Pad Spacing: 0.0002" Pad Size: 0.001" Package Backside Material: Material: RO4003 (0.008" thk) w/ 0.5oz Cu (0.0007" thk) Plating: 100 - 350in Ni underplate w/ 5 - 10in Au overplate TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 10 Advance Product Datasheet April 6, 2006 TGA4819-SL Assembly of a TGA4819-SL Package onto a Motherboard Manual Assembly for Prototypes 1. Clean the motherboard with Acetone and rinse with alcohol and DI water. Allow the motherboard to fully dry. 2. Using a standard SN63 or lead-free solder paste, dispense solder paste dots of 5 to 15 mil in diameter to the motherboard. Assure that there is a minimum of 5 mils and a maximum of 10 mils between the edge of each solder paste area and the closest edge of the ground pad. 3. Manually place a TGA4819-SL on the motherboard with correct orientation and good alignment. The alignment can be determined manually by centering the package on the motherboard. The RF traces (pin 1 and pin 10) are located along the center horizontal axis of the package. 4. Reflow the assembly on a hot plate with the surface temperature of the plate near 230 oC for 5 to 6 seconds (for SnPb). 5. Let the assembly completely cool down. This package has little or no tendency to self- align during the reflow. 6. Clean the assembly with acetone and rinse with alcohol and DI water. Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature Time above Melting Point Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate SnPb 3 C/sec 60 - 120 sec @ 140 - 160 C 60 - 150 sec 240 C 10 - 20 sec 4 - 6 C/sec Pb Free 3 C/sec 60 - 180 sec @ 150 - 200 C 60 - 150 sec 260 C 10 - 20 sec 4 - 6 C/sec CAUTION: The TGA4819-SL contains GaAs MMIC devices that are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com 11 |
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